| As an all-new process method, thanks to its advantages of high precision, speediness, simplified operation and high degree of automation, laser marking and cutting technologies have been applied gradually far and wide in textile and leather industries. And the advanced technology keeps manufacturers at the forefront of fashion. |
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- Cable
- Ceramics
- IC
- Silicon Wafer
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Information
Cabel Marking
Production date and figures can be marked on cable by burned off the surface layer of the cable.
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Ceramic Cutting
Star lase ceramics cutters and slicers are suitable for industrial ceramics, which is widely used in electron, chemical and equipment industries.
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Information
IC Marking
IC is usually covered by a coating of epoxy resin. Many IC parts can be processed by laser, such as CMOS chips, memory stick, integrate curcuit, resistance, capacitance, crystalloid and diode etc.
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Information
Silicon Wafer Cutting
Silicon wafer is mainly applied in the semiconductor industry. The laser is able to slice, cut or groove on the surfaces silicon, polysilicon, germanium and gallium arsenide etc. The technology will not damage the both sides of the silicon, nor the performance of the product. As a result, the manufacturing efficiency as well as production efficiency is greatly improved.
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