| Silicon wafer slicer is mainly applied in the solar battery industry and the semiconductor industry. The laser is able to slice, cut or groove on the surfaces of silicon, polysilicon, germanium and gallium arsenide etc. The technology will not damage any side of the silicon, nor the performance of the product. As a result, the manufacturing efficiency as well as production efficiency is greatly improved. |
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Solar Cell Cutting
Solar Cell is mainly applied in the solar battery industry and the semiconductor industry. The laser is able to slice, cut or groove on the surfaces of silicon, polysilicon, germanium and gallium arsenide etc. The technology will not damage the both sides of the silicon, nor the performance of the product. As a result, the manufacturing efficiency as well as production efficiency is greatly improved
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